Invention Application
- Patent Title: MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 多层陶瓷电子元件及其制造方法
-
Application No.: US14320150Application Date: 2014-06-30
-
Publication No.: US20150092316A1Publication Date: 2015-04-02
- Inventor: Byoung Jin CHUN , Je Ik MOON , Jae Hwan HAN , Seung Hee YOO
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2013-0118113 20131002
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B.
Public/Granted literature
- US09583265B2 Multilayer ceramic electronic component and method of manufacturing the same Public/Granted day:2017-02-28
Information query