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    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT BOARD HAVING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT BOARD HAVING THE SAME 有权
    多层陶瓷电子元件及其制造方法以及具有相同功能的电路板

    公开(公告)号：US20160211074A1

    公开(公告)日：2016-07-21

    申请号：US14794569

    申请日：2015-07-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Hee GU ,  Myung Jun PARK ,  Hye Jin JEONG ,  Byoung Jin CHUN ,  Young Sook LEE ,  Hye Young CHOI ,  Chung Yeol LEE

    IPC: H01G2/06 ,  H01G4/12 ,  H05K1/11 ,  H01G4/248 ,  H05K1/18 ,  H01G4/012 ,  H01G4/30

    CPC classification number: H05K1/0306 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/0067 ,  H05K2201/10015

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.

    Abstract translation: 多层陶瓷电子部件包括陶瓷体，该陶瓷体包括电介质层和内部电极，并且具有沿第一方向彼此相对的第一和第二表面，在第二方向上彼此相对的第三和第四表面，以及在第二方向上彼此相对的第五和第六表面 第三方向，设置在陶瓷体上的基极电极层，包括连接到内部电极的主要部分和从主要部分延伸的延伸部分，以及设置在基底电极层上的树脂电极层，同时使延伸部分的端部露出。 延伸部分的宽度比沿着延伸部分的宽度方向平行的方向测量的陶瓷体的设置有延伸部分的外表面的宽度窄。

    MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME MOUNTED THEREON
    2.
    发明申请
    MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其制造方法及其安装的板

    公开(公告)号：US20150090483A1

    公开(公告)日：2015-04-02

    申请号：US14140276

    申请日：2013-12-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Je Ik MOON ,  Byoung Jin CHUN ,  Hang Kyu CHO ,  Jae Hwan HAN

    IPC: H01G4/008 ,  H05K1/16 ,  H01G4/12 ,  H01G4/30

    CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  Y10T29/435

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

    Abstract translation: 提供一种多层陶瓷电容器，其包括：陶瓷体，其包括电介质层和内部电极; 电极层，其设置在所述陶瓷体的外表面上，与所述内部电极电连接; 第一复合树脂层，设置在所述电极层上并且包括第一导电粉末; 以及第二复合树脂层，其设置在所述第一复合树脂层上并且包括不同于所述第一导电粉末的第二导电粉末。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20140233147A1

    公开(公告)日：2014-08-21

    申请号：US13871767

    申请日：2013-04-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kyung Pyo HONG ,  Byung Jun JEON ,  Byoung Jin CHUN ,  Jae Hwan HAN

    IPC: H01G4/008 ,  H01G4/12

    CPC classification number: H01G4/008 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

    Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

    Abstract translation: 提供了一种多层陶瓷电子部件，包括：包含电介质层的陶瓷体; 堆叠在陶瓷体内的多个内部电极，以及形成在陶瓷体的外表面上并与内部电极电连接的外部电极，其中外部电极包括形成在金属层上的金属层和导电树脂层， 含有铜粉末和环氧树脂的导电树脂层，所述铜粉末包含含量为10重量％以上且粒径为2μm以上的第一铜粉末和含有5重量％以上的第二铜粉末的铜粉末， 以上且0.7μm以下的粒径，第一铜粉末为球状粉末粒子和片状粉末粒子的混合物。

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电容器及其制造方法

    公开(公告)号：US20140204502A1

    公开(公告)日：2014-07-24

    申请号：US13934959

    申请日：2013-07-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Jin CHUN ,  Byung Jun JEON ,  Kyung Pyo HONG ,  Jae Hwan HAN

    IPC: H01G4/008

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  Y10T29/43

    Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.

    Abstract translation: 提供了一种多层陶瓷电容器，其包括：陶瓷体，其包括电介质层;第一和第二内部电极，其形成在陶瓷体内并且彼此相对地设置，其间具有介电层;第一和第二电极层，设置在陶瓷体的外表面上 陶瓷体，分别与第一和第二内部电极电连接，设置在第一和第二电极层上并含有铜粉末的导电树脂层，设置在导电树脂层的外部的镀镍层，以及铜 镍合金层，设置在导电性树脂层和镀镍层之间，厚度为1〜10nm。

    MULTILAYER CERAMIC COMPONENT
    8.
    发明申请
    MULTILAYER CERAMIC COMPONENT 审中-公开
    多层陶瓷组件

    公开(公告)号：US20160268044A1

    公开(公告)日：2016-09-15

    申请号：US14862106

    申请日：2015-09-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Hee GU ,  Myung Jun PARK ,  Byoung Jin CHUN ,  Young Sook LEE ,  Hye Jin JEONG ,  Hye Young CHOI ,  Chung Yeol LEE

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/236 ,  H01G4/30

    CPC classification number: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

    Abstract: A multilayer ceramic component is provided. The multilayer ceramic component includes a ceramic body including a plurality of ceramic laminates, each including a plurality of dielectric layers and a plurality of internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and a plurality of external electrodes including base electrode layers disposed on outer surfaces of the ceramic body and respectively connected to the internal electrodes of the ceramic laminates, and resin electrode layers disposed on the base electrode layers to expose at least portions of end portions of the base electrode layers, respectively.

    Abstract translation: 提供了多层陶瓷部件。 所述多层陶瓷部件包括陶瓷体，所述陶瓷体包括多个陶瓷层叠体，每个陶瓷层叠体包括多个电介质层和多个内部电极，并且具有在第一方向上彼此相对的第一和第二表面， 第二方向，以及在第三方向上彼此相对的第五和第六表面，以及多个外部电极，包括设置在陶瓷体的外表面上并分别连接到陶瓷层压体的内部电极的基极电极层，以及树脂电极 分别设置在基极电极层上以暴露基极电极层的端部的至少一部分的层。

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    9.
    发明申请
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    芯片电子元件和板子

    公开(公告)号：US20160042857A1

    公开(公告)日：2016-02-11

    申请号：US14657845

    申请日：2015-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Jin CHUN ,  Woo Kyung SUNG ,  Hyun Hee GU ,  Young Sook LEE ,  Hye Jin JEONG ,  Jae Hwan HAN

    IPC: H01F27/28 ,  H01F1/20 ,  H01F27/255

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048

    Abstract: There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.

    Abstract translation: 提供了一种芯片电子部件，包括：包括绝缘基板的磁体和布置在绝缘基板的至少一个表面上的导电线圈图案; 以及外部电极，其设置在所述磁性体的两端部，以与所述导电线圈图案的端部连接，其中，所述外部电极中的每一个包括设置在所述磁性体的端面上的第一镀层，以与所述导体 线圈图案和覆盖第一镀层并延伸到磁性体主表面的导电树脂层。

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