A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist.