公开(公告)号：US20150213946A1

公开(公告)日：2015-07-30

申请号：US14604105

申请日：2015-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Takashi KARIYA

IPC: H01F27/28

CPC classification number: H01F17/04 ,  H01F17/0013 ,  H01F2017/002

Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on first-surface side of the substrate, a second buildup layer formed on second-surface side of the substrate, and an inductor component formed on the second-surface side of the substrate. The inductor component includes a base layer, first conductive patterns formed on first surface of the base layer, second conductive patterns formed on second surface of the base layer and through-hole conductors connecting the first and second conductive patterns through the base layer such that the inductor component has an inductor structure having the first conductive patterns, the second conductive patterns and the through-hole conductors, and the base layer of the inductor component has a magnetic body structure including magnetic material such that the magnetic body structure is positioned on an inner side of the inductor structure.

Abstract translation: 印刷电路板包括芯基板，形成在基板的第一表面侧上的第一累积层，形成在基板的第二表面侧上的第二累积层和形成在基板的第二表面侧上的电感器部件 基质。 电感器部件包括基底层，形成在基底层的第一表面上的第一导电图案，形成在基底层的第二表面上的第二导电图案和通过基底层连接第一和第二导电图案的通孔导体， 电感器部件具有具有第一导电图案，第二导电图案和通孔导体的电感器结构，并且电感器部件的基极层具有包括磁性材料的磁体结构，使得磁体结构位于内部 一侧的电感结构。

公开(公告)号：US20150114689A1

公开(公告)日：2015-04-30

申请号：US14522742

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI ,  Takashi KARIYA

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.

Abstract translation: 挠性刚性布线板包括柔性基板，非柔性基板，定位成使得非柔性基板在柔性基板的水平方向上延伸;形成在柔性和非柔性基板的第一表面上的第一布线层 嵌入在所述柔性和非柔性基板的第二表面中的第二布线层，覆盖所述柔性和非柔性基板的所述第一表面的第一绝缘层，并且具有暴露柔性基板的第一表面的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二表面的第二绝缘层，并且具有露出柔性基板的第二表面的一部分的开口。 第一布线层包括在柔性和非柔性基板的第一表面上的非嵌入布线，并且第二布线层包括在柔性和非柔性基板的第二表面中的嵌入布线。

公开(公告)号：US20140014399A1

公开(公告)日：2014-01-16

申请号：US13754185

申请日：2013-01-30

Applicant: IBIDEN CO., LTD.

Inventor： Takashi KARIYA ,  Toshiki FURUTANI ,  Takeshi FURUSAWA

IPC: H05K1/02

CPC classification number: H05K1/02 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

Abstract translation: 印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。 芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层 第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，以及第一和第二结构 第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。 ％。

公开(公告)号：US20160217911A1

公开(公告)日：2016-07-28

申请号：US15004030

申请日：2016-01-22

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/324

Abstract: An inductor component includes a resin insulating layer having an opening portion, a first coil formed on a first surface of the resin insulating layer such that the first coil is surrounding the opening portion, a second coil that is formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface such that the second coil is surrounding opening portion, a via conductor formed through the resin insulating layer such that the via conductor is connecting the first coil and the second coil, and a magnetic body structure having an opening portion magnetic body filling the opening portion of the resin insulating layer, a first surface magnetic body covering the first coil, and a second surface magnetic body covering the second coil.

Abstract translation: 电感器部件包括具有开口部的树脂绝缘层，形成在树脂绝缘层的第一表面上的第一线圈，使得第一线圈围绕开口部，形成在树脂的第二表面上的第二线圈 绝缘层，其相对于第一表面在相对侧上，使得第二线圈围绕开口部分;通孔导体，其形成为穿过树脂绝缘层，使得通孔导体连接第一线圈和第二线圈;以及磁体 具有填充树脂绝缘层的开口部的开口部磁性体，覆盖第一线圈的第一表面磁性体和覆盖第二线圈的第二表面磁性体的结构。

公开(公告)号：US20160105960A1

公开(公告)日：2016-04-14

申请号：US14880299

申请日：2015-10-12

Applicant: IBIDEN CO., LTD.

Inventor： Hajime SAKAMOTO ,  Yoshinori SHIZUNO ,  Shigeru YAMADA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/5383 ,  H01L21/486 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2924/15192 ,  H01L2924/15313 ,  H05K3/007 ,  H05K3/025 ,  H05K3/4644 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053

Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.

Abstract translation: 多层布线基板包括：主布线板，包括绝缘层，形成在绝缘层中的第一通孔导体;以及第一导电层，包括第一安装焊盘，使得第一安装焊盘定位成安装第一电子部件和第二电子部件 以及配线结构体，其安装在主配线板上，使得布线结构体位于绝缘层的最外绝缘层中，所述布线结构体包括第二导电层，所述第二导电层包括： 第二安装焊盘，使得第二安装焊盘被定位成连接到安装在主布线板上的第一电子部件和第二电子部件。 第一通孔导体形成为使得第一通孔导体具有沿相同方向增加的直径。

公开(公告)号：US20150366102A1

公开(公告)日：2015-12-17

申请号：US14737943

申请日：2015-06-12

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H05K7/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/4608 ,  H05K2201/09127 ,  Y10T29/49126 ,  Y10T29/49167 ,  H01L2924/00

Abstract: An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.

Abstract translation: 电子电路装置包括电路基板，位于电路基板上的发热部件，形成电路基板的内层的一部分的金属板，从电路基板的侧面突出，使得金属板具有 露出部分暴露于电路基板外部，外部部件连接到金属板的暴露部分，并且包括外部散热部件和外部冷却部件之一。

公开(公告)号：US20160042861A1

公开(公告)日：2016-02-11

申请号：US14820666

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Toshihiko ONOGI ,  Kazuhiro YOSHIKAWA ,  Yuki TANAKA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H01F27/28 ,  H01F27/245

CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F2027/2809

Abstract: A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

Abstract translation: 印刷布线板包括具有空腔的芯基板，位于基板的空腔中的电感器部件，形成在基板的第一表面上的第一累积层和形成在基板的第二表面上的第二累积层。 电感器部件包括具有第一开口的绝缘层和形成在第一开口之间的第二开口，分别形成在第一开口中的导电通孔，形成在第二开口中的磁体，形成在绝缘体的第一表面上的第一互连 并且连接绝缘层的第一表面上的导电通孔，以及形成在绝缘层的第二表面上并连接绝缘层的第二表面上的导电通孔的第二互连和第一互连，第二互连 并且导电通孔被定位成形成螺旋结构。

公开(公告)号：US20150264817A1

公开(公告)日：2015-09-17

申请号：US14723520

申请日：2015-05-28

Applicant: IBIDEN CO., LTD.

Inventor： Makoto TERUI ,  Daiki KOMATSU ,  Masatoshi KUNIEDA ,  Takashi KARIYA

IPC: H05K3/30 ,  H01L23/00 ,  H05K3/32 ,  H05K3/20 ,  H05K3/10 ,  H05K3/46 ,  H01L25/00 ,  H01L23/498

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5382 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/10 ,  H05K3/103 ,  H05K3/20 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/014

Abstract: A method for manufacturing a wiring board includes positioning on a first insulation layer a wiring structure including an insulation layer and conductive patterns formed on the insulation layer, forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer, forming a via conductor through the second insulation layer, and forming conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer.

Abstract translation: 一种布线基板的制造方法，其特征在于，在第一绝缘层上具有绝缘层和形成于绝缘层上的导电图案的布线结构，在第一绝缘层和布线结构上形成第二绝缘层，使布线结构为 插入在第一绝缘层和第二绝缘层之间，通过第二绝缘层形成通孔导体，并且在第二绝缘层上形成导电图案，使得第二绝缘层上的导电图案之一连接到通孔导体 第二绝缘层。

公开(公告)号：US20140347837A1

公开(公告)日：2014-11-27

申请号：US14283337

申请日：2014-05-21

Applicant: IBIDEN CO., LTD.

Inventor： Takashi KARIYA ,  Yoshinori Shizuno ,  Makoto Terui ,  Masatoshi Kunieda

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4682 ,  H05K3/0035 ,  H05K3/3436 ,  H05K3/4694 ,  H05K2201/10159

Abstract: A wiring board includes multiple insulation layers including an outermost insulation layer, a first conductive pattern formed between the insulation layers, a wiring structure positioned in the outermost insulation layer and having multiple first pads such that the first pads are positioned to connect multiple terminals of a first electronic component, respectively, and multiple second pads formed on the outermost insulation layer such that the second pads are positioned to connect terminals of a second electronic component, respectively, and are set at intervals which are greater than intervals of the first pads.

Abstract translation: 布线板包括多个绝缘层，包括最外绝缘层，形成在绝缘层之间的第一导电图案，位于最外绝缘层中的布线结构，并且具有多个第一焊盘，使得第一焊盘定位成连接多个绝缘层的多个端子 分别形成在第一绝缘层上的第一电子部件和多个第二焊盘，使得第二焊盘分别定位成连接第二电子部件的端子，并设置成大于第一焊盘间隔的间隔。

公开(公告)号：US20140020940A1

公开(公告)日：2014-01-23

申请号：US13938637

申请日：2013-07-10

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/165 ,  H01L2924/3511 ,  H05K1/0233 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/30 ,  H05K3/4676 ,  H05K3/4697 ,  H05K2201/0209 ,  Y10T29/4913

Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.

Abstract translation: 印刷电路板包括芯基板，形成在芯基板的第一表面上并包括绝缘层和导电层的第一累积层，在相对侧的芯基板的第二表面上形成的第二累积层， 相对于第一累积层，并且包括绝缘层和导电层，以及位于第二堆积层中的电感器件，并且包括树脂绝缘层和形成在树脂绝缘层上的线圈层。 第二累积层具有容纳电感器装置的空腔。