Invention Application
- Patent Title: VISCOELASTICITY MEASUREMENT METHOD AND VISCOELASTICITY MEASUREMENT DEVICE
- Patent Title (中): 粘弹性测量方法和粘弹性测量装置
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Application No.: US14374783Application Date: 2013-01-25
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Publication No.: US20150094964A1Publication Date: 2015-04-02
- Inventor: Masaharu Kuroda , Yasuyuki Yamamoto , Hiroshi Yabuno
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo
- Priority: JP2012-015801 20120127; JP2012-015802 20120127; JP2012-015803 20120127
- International Application: PCT/JP2013/000406 WO 20130125
- Main IPC: G01N11/16
- IPC: G01N11/16

Abstract:
A linear elastic modulus measurement method and a linear elastic modulus measurement device can reduce external disturbances such as oscillation and electrical noise, and accurately and stably measure the linear elastic modulus of a linear elastic body even in the case where damping due to viscous stress is large. The measurement device computes the oscillation velocity (dx/dt) of an oscillator from the displacement of the oscillator brought into contact with the linear elastic body, and multiplies dx/dt by a linear velocity feedback gain to generate a feedback control signal. The measurement device applies, to the oscillator, a force proportional to the oscillation velocity of the oscillator by the feedback control signal, to cause the oscillator to self-oscillate. The measurement device computes the linear elastic modulus of the linear elastic body from the frequency when the self-oscillation of the oscillator is detected and the mass of the oscillator.
Public/Granted literature
- US10180382B2 Viscoelasticity measurement method and viscoelasticity measurement device Public/Granted day:2019-01-15
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