Invention Application
- Patent Title: Sealed MEMS Devices with Multiple Chamber Pressures
- Patent Title (中): 具有多室压力的密封MEMS器件
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Application No.: US14045855Application Date: 2013-10-04
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Publication No.: US20150097253A1Publication Date: 2015-04-09
- Inventor: Christine H. Tsau , Li Chen , Kuang L. Yang
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; H01L29/84

Abstract:
A MEMS apparatus has a substrate, a cap forming first and second chambers with the base, and movable microstructure within the first and second chambers. To control pressures, the MEMS apparatus also has a first outgas structure within the first chamber. The first outgas structure produces a first pressure within the first chamber, which is isolated from the second chamber, which, like the first chamber, has a second pressure. The first pressure is different from that in the second pressure (e.g., a higher pressure or lower pressure).
Public/Granted literature
- US09102512B2 Sealed MEMS devices with multiple chamber pressures Public/Granted day:2015-08-11
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