发明申请
- 专利标题: Dicing Device and Dicing Method
- 专利标题(中): 切割装置和切割方法
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申请号: US14569061申请日: 2014-12-12
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公开(公告)号: US20150099428A1公开(公告)日: 2015-04-09
- 发明人: Takashi Fujita , Junji Watanabe
- 申请人: Junji Watanabe , Tokyo Seimitsu Co., Ltd.
- 优先权: JP2012-136060 20120615
- 主分类号: B24B19/02
- IPC分类号: B24B19/02 ; B24B9/06
摘要:
To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device which performs cutting process on a workpiece includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80% or more of the diamond abrasive grains; a spindle (rotating mechanism) configured to rotate the dicing blade; and a movement mechanism configured to move the workpiece relatively to the dicing blade while forming a constant cut depth on the workpiece by the dicing blade.
公开/授权文献
- US3105752A Muffler 公开/授权日:1963-10-01