公开(公告)号：US11778766B2

公开(公告)日：2023-10-03

申请号：US17087634

申请日：2020-11-03

申请人： Acer Incorporated

发明人： Wen-Hsin Lin ,  Cheng-Nan Ling ,  Wen-Chieh Tai

IPC分类号： H05K5/04 ,  B23K26/362 ,  B24B19/02 ,  C25D13/20

CPC分类号： H05K5/04 ,  B23K26/362 ,  B24B19/02 ,  C25D13/20

摘要： A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided.

公开(公告)号：US11504869B2

公开(公告)日：2022-11-22

申请号：US17187538

申请日：2021-02-26

申请人： Tokyo Seimitsu Co., Ltd.

发明人： Takahiro Iida ,  Teruhiko Nishikawa ,  Tasuku Shimizu

IPC分类号： B24B51/00 ,  B26D3/06 ,  B26D5/00 ,  B26D7/01 ,  B24B19/02 ,  B23Q15/26 ,  B23Q17/24 ,  B23C3/28

摘要： A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

公开(公告)号：US20220088742A1

公开(公告)日：2022-03-24

申请号：US17457090

申请日：2021-12-01

申请人： DISCO CORPORATION

发明人： Keisuke YAMAMOTO

IPC分类号： B24B19/02

摘要： A grinding method for grinding a workpiece by use of a grinding apparatus including a holding table that holds the workpiece by a holding surface, and a grinding unit that grinds the workpiece held by the holding table by a grinding wheel having a plurality of grindstones arranged in an annular pattern includes a groove forming step of grinding the workpiece by bringing the grindstones into contact with the workpiece to form the workpiece with an arcuate groove having a depth of less than a finished thickness of the workpiece, and a grinding step of bringing the grindstones into contact with a surface side of the workpiece where the groove is formed to grind the workpiece until the thickness of the workpiece becomes the finished thickness.

公开(公告)号：US20210260676A1

公开(公告)日：2021-08-26

申请号：US17314580

申请日：2021-05-07

申请人： Atlas Copco Airpower, N.V.

发明人： Jozef Carlo VERBINNEN

IPC分类号： B23F15/08 ,  B24B5/16 ,  B24B19/02 ,  B24B27/00 ,  B24B5/01 ,  B23Q3/157 ,  B24B29/00

摘要： A method for manufacturing a rotor includes the following operations: the clamping of a workpiece in a grinding machine; the performance of one or more cylindrical grinding operations whereby a rotor shaft section is ground to the desired diameter with a cylindrical grinding disk; the performance of one more profile grinding operations whereby a rotor body is profiled with a profile grinding disk. During the manufacture of the rotor in the grinding machine, the workpiece is not undamped and the cylindrical grinding operations and the profile grinding operations are done with the same grinding machine.

公开(公告)号：US10814416B2

公开(公告)日：2020-10-27

申请号：US15763603

申请日：2016-09-26

申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.

发明人： Atsushi Sato ,  Keisuke Kitamura ,  Mitsuaki Abe ,  Tetsuya Yonezawa ,  Tatsuyoshi Maruyama ,  Osamu Yoshida ,  Kenji Kagami

IPC分类号： B24B19/02 ,  B23G1/38 ,  B62D5/04 ,  F16H25/22 ,  F16H25/24 ,  F16H25/20

摘要： In a power steering device equipped with a rack shaft constructed by joining a first member having rack teeth and a second member serving as a ball screw shaft on which a ball screw groove is formed, a grinding process of the ball screw groove is performed on the second member by causing a grindstone to rotate and move along a rotation axis of the second member, while causing the second member to rotate about an axis of the second member as the rotation axis. The grinding process is performed so as to satisfy a specified machining condition “g/(5×p)

公开(公告)号：US10576602B2

公开(公告)日：2020-03-03

申请号：US15566281

申请日：2017-03-03

申请人： Erwin Junker Maschinenfabrik GmbH

发明人： Erwin Junker

IPC分类号： B24B27/00 ,  B24B19/00 ,  B24B19/02 ,  B23F1/02 ,  B24B41/06 ,  B24B5/04 ,  B24B53/053 ,  B23Q3/155

摘要： Described is a method for grinding workpieces, which comprise at least one cylindrical and profiled portion each, on one and the same grinding machine. The workpiece is ground initially in a first grinding operation in a first clamping in the grinding machine, said first grinding operation being followed by a second grinding operation once the first clamping has been released and then, before the start of the second grinding operation, a second clamping has been generated.

公开(公告)号：US20180369983A1

公开(公告)日：2018-12-27

申请号：US15566281

申请日：2017-03-03

申请人： ERWIN JUNKER MASCHINENFABRIK GMBH

发明人： Erwin Junker

IPC分类号： B24B27/00 ,  B24B19/00 ,  B24B5/04 ,  B24B19/02 ,  B24B41/06 ,  B23F1/02 ,  B23Q3/155

CPC分类号： B24B27/0076 ,  B23F1/02 ,  B23Q3/155 ,  B24B5/04 ,  B24B19/009 ,  B24B19/022 ,  B24B41/062 ,  B24B41/065 ,  B24B53/053 ,  F04C2230/10 ,  F04C2240/20

摘要： Described is a method for grinding workpieces, which comprise at least one cylindrical and profiled portion each, on one and the same grinding machine. The workpiece is ground initially in a first grinding operation in a first clamping in the grinding machine, said first grinding operation being followed by a second grinding operation once the first clamping has been released and then, before the start of the second grinding operation, a second clamping has been generated.

公开(公告)号：US20180056472A1

公开(公告)日：2018-03-01

申请号：US15681471

申请日：2017-08-21

申请人： SANSHIN CO., LTD.

发明人： Nobukazu HOSOKAI ,  Takayuki ADACHI

IPC分类号： B24B21/16 ,  B24B29/02 ,  B23G9/00 ,  B24B19/02

CPC分类号： B24B21/16 ,  B23G1/36 ,  B23G9/004 ,  B24B19/022 ,  B24B21/004 ,  B24B29/02 ,  F16H25/2204 ,  F16H25/24 ,  F16H2025/2481

摘要： The invention has a turnback roll which can transfer and guide a polishing tap in a tangential direction of a pressure contacting roll, a vertical oscillation mechanism which linearly oscillates the pressure contacting roll in a tangential direction of a ball groove while being orthogonal to a rotating axis line, and a horizontal oscillation mechanism which linearly oscillates the pressure contacting roll in a direction of a rotating axis line toward both inner side surfaces of the ball groove. The ball groove can be securely polished by the polishing tape on the basis of the continuous or intermittent transfer of the polishing tape and the linear oscillating motion of the ball groove. It is possible to improve a polishing precision, it is possible to improve a surface roughness of the ball groove and it is possible to improve a polishing workability of the ball groove.

公开(公告)号：US09887091B2

公开(公告)日：2018-02-06

申请号：US14704605

申请日：2015-05-05

申请人： DISCO CORPORATION

发明人： Katsuhiko Suzuki

IPC分类号： H01B13/00 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  H01L21/302 ,  H01L21/461 ,  H01L21/311 ,  H01L21/304 ,  H01L21/02 ,  H01L23/544 ,  B24B1/00 ,  H01L41/338 ,  H01L21/683 ,  H01L21/78 ,  H01L21/67 ,  B24B19/02 ,  B24B7/22

CPC分类号： H01L21/304 ,  B24B1/00 ,  B24B7/228 ,  B24B19/02 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/02019 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L41/338 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of processing a wafer includes: a grinding step of grinding a back surface of the wafer to form, on the back side of the wafer, a recess corresponding to a device region and an annular projecting portion corresponding to a peripheral marginal region; and a splitting groove forming step of forming, after the grinding step is conducted, a splitting groove for splitting the device region and the peripheral marginal region from each other at the boundary between the recess and the annular projecting portion, the splitting groove extending from the front surface of the wafer to reach the back surface of the wafer. The splitting groove is formed by dry etching.

公开(公告)号：US09662721B2

公开(公告)日：2017-05-30

申请号：US12037387

申请日：2008-02-26

申请人： Changsheng Guo

发明人： Changsheng Guo

IPC分类号： F03B3/12 ,  B23C3/34 ,  B24B19/02 ,  F01D5/30

CPC分类号： F01D5/3007 ,  B23C3/34 ,  B23C5/10 ,  B23C2215/52 ,  B23C2220/28 ,  B23C2220/366 ,  B24B19/022 ,  F05D2220/32 ,  F05D2240/30 ,  F05D2250/71 ,  Y10T29/49336

摘要： A method of forming a curved slot in a turbine disk includes the steps of forming a pre-slot in the turbine disk and finishing the pre-slot to form a slot that receives a portion of a turbine blade. The turbine disk including a first face, an opposing second face, and an outer perimeter surface extending between the first face and the opposing second face. The pre-slot includes a first curved wall and a second curved wall that each extend between the first face and the opposing second face. An intersection between the outer perimeter surface and each of the first curved wall and the second curved wall is defined by a curved line.