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发明申请
US20150115426A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACAKGE USING THE SAME 有权
印刷电路板及其制造方法和使用其的半导体PACAKGE

  • 专利标题： PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACAKGE USING THE SAME
  • 专利标题（中）： 印刷电路板及其制造方法和使用其的半导体PACAKGE
  • 申请号： US14524688
    申请日： 2014-10-27
  • 公开(公告)号： US20150115426A1
    公开(公告)日： 2015-04-30
  • 发明人: Ji Haeng LEE , Dong Sun KIM , Sung Wuk RYU
  • 申请人： LG INNOTEK CO., LTD.
  • 优先权： KR10-2013-0127594 20131025
  • 主分类号： H01L23/00
  • IPC分类号： H01L23/00 ;  H05K1/11 ;  H05K1/09 ;  H01L23/495
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACAKGE USING THE SAME
摘要：
Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.
摘要（中）：

提供一种可用作封装用基板的印刷电路板，印刷电路板的制造方法以及使用该印刷电路板的半导体封装，所述印刷电路板包括：第一基板，具有第一安装面积 用于安装封装基板和用于安装半导体元件的第二安装区域; 第一衬底的单层或多层电路图案; 以及设置在所述第一安装区域的外部绝缘层上并且具有凹形上表面的连接到所述电路图案的柱凸块。

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