公开(公告)号：US20160351506A1

公开(公告)日：2016-12-01

申请号：US15117373

申请日：2015-01-28

申请人： LG INNOTEK CO., LTD.

发明人： Dong Sun KIM ,  Sung Wuk RYU ,  Ji Haeng LEE

IPC分类号： H01L23/538 ,  H01L25/00 ,  H01L21/48 ,  H01L25/10

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3463 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/041 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099

摘要： The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.

摘要翻译： 根据一个实施例的印刷电路板包括：绝缘基板; 衬垫，形成在所述绝缘衬底的至少一侧上; 保护层，其形成在所述绝缘基板上并暴露所述焊盘的上表面; 以及形成在由保护层暴露的焊盘上的凸块，其中所述凸块包括具有彼此不同的熔点的多个焊料层。

公开(公告)号：US20160133604A1

公开(公告)日：2016-05-12

申请号：US14937935

申请日：2015-11-11

申请人： LG INNOTEK CO., LTD.

发明人： Sung Wuk RYU ,  Dong Sun KIM ,  Hyun Seok SEO ,  Ji Haeng LEE

IPC分类号： H01L25/065 ,  H01L23/00

CPC分类号： H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/37001 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post.

摘要翻译： 半导体封装包括：上部封装件，元件安装到该上部封装件，并且其包括金属焊盘部分; 连接到所述金属焊盘部分的金属柱; 以及安装元件的下封装，并且连接到金属柱。

公开(公告)号：US20160351543A1

公开(公告)日：2016-12-01

申请号：US15117345

申请日：2015-01-28

申请人： LG INNOTEK CO., LTD.

发明人： Sung Wuk RYU ,  Dong Sun KIM ,  Ji Haeng LEE ,  Sang Hyuck NAM

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15701 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/144 ,  H05K1/186 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2201/10734 ,  H01L2924/00012

摘要： A printed circuit board according to the present invention comprises: an insulating substrate; a plurality of pads formed on the upper surface of the insulating substrate; a protective layer which comprises an opening part for exposing the upper surfaces of the plurality of pads, and is formed on the insulating substrate; and a metal bump which is formed on the first pad and the second pad in the plurality of pads, and projects above the surface of the protective layer, and, here, the first pad is formed to the left of the central upper part of the insulating substrate, while the second pad is formed to the right of the central upper part of the insulating substrate.

摘要翻译： 根据本发明的印刷电路板包括：绝缘基板; 形成在所述绝缘基板的上表面上的多个焊盘; 保护层，其包括用于暴露所述多个焊盘的上表面的开口部，并且形成在所述绝缘基板上; 以及金属凸块，其形成在所述多个焊盘中的所述第一焊盘和所述第二焊盘上，并且在所述保护层的表面上方突出，并且在这里，所述第一焊盘形成在所述保护层的中央上部的左侧 绝缘基板，而第二焊盘形成在绝缘基板的中央上部的右侧。

公开(公告)号：US20150382463A1

公开(公告)日：2015-12-31

申请号：US14753087

申请日：2015-06-29

申请人： LG INNOTEK CO., LTD.

发明人： Dong Sun KIM ,  Sung Wuk RYU ,  Hyun Seok SEO ,  Ji Haeng LEE

IPC分类号： H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC分类号： H05K3/4007 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/144 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2203/1383 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

摘要： A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

摘要翻译： 印刷电路板包括绝缘基板，绝缘基板的顶表面上的多个焊盘，形成在绝缘基板上并具有露出焊盘顶表面的开口的保护层，形成在至少一个 并且保护层的表面向上突出。 凸块具有弯曲的侧面。

公开(公告)号：US20150115426A1

公开(公告)日：2015-04-30

申请号：US14524688

申请日：2014-10-27

申请人： LG INNOTEK CO., LTD.

发明人： Ji Haeng LEE ,  Dong Sun KIM ,  Sung Wuk RYU

IPC分类号： H01L23/00 ,  H05K1/11 ,  H05K1/09 ,  H01L23/495

CPC分类号： H01L24/16 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16059 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K1/09 ,  H05K1/111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

摘要翻译： 提供一种可用作封装用基板的印刷电路板，印刷电路板的制造方法以及使用该印刷电路板的半导体封装，所述印刷电路板包括：第一基板，具有第一安装面积 用于安装封装基板和用于安装半导体元件的第二安装区域; 第一衬底的单层或多层电路图案; 以及设置在所述第一安装区域的外部绝缘层上并且具有凹形上表面的连接到所述电路图案的柱凸块。

公开(公告)号：US20150076691A1

公开(公告)日：2015-03-19

申请号：US14487793

申请日：2014-09-16

申请人： LG INNOTEK CO., LTD.

发明人： Dong Sun KIM ,  Sung Wuk RYU ,  Ji Haeng LEE

IPC分类号： H01L23/00

CPC分类号： H01L24/12 ,  H01L23/49822 ,  H01L23/5389 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/35 ,  H01L2924/384 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a semiconductor package, including: a lower package to which elements are mounted; a metal post connected to the lower package and including at least one metal material portion; and an upper package to which elements is mounted, and which is connected to the metal post via a solder ball.

摘要翻译： 提供了一种半导体封装，包括：安装元件的下封装; 金属柱，其连接到所述下部封装并且包括至少一个金属材料部分; 以及安装元件的上部封装，并且经由焊球与金属柱连接。