Invention Application
US20150115465A1 Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
有权
一种嵌入式PCB单元的表面平衡半导体器件和方法，具有虚拟铜模式
- Patent Title: Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
- Patent Title (中): 一种嵌入式PCB单元的表面平衡半导体器件和方法，具有虚拟铜模式
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Application No.: US14329464Application Date: 2014-07-11
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Publication No.: US20150115465A1Publication Date: 2015-04-30
- Inventor: Yaojian Lin , Kang Chen , Hin Hwa Goh , Il Kwon Shim
- Applicant: STATS ChipPAC, Ltd.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate.
Public/Granted literature
- US09449943B2 Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Public/Granted day:2016-09-20
Information query
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