发明申请
- 专利标题： Integrated Mechanical Device with Vertical Movement
- 专利标题（中）： 具有垂直运动的集成机械装置
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申请号： US14517369申请日： 2014-10-17
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公开(公告)号： US20150116072A1公开(公告)日： 2015-04-30
- 发明人: Christian Rivero , Pascal Fornara , Antonio di-Giacomo , Brice Arrazat
- 申请人： STMicroelectronics (Rousset) SAS
- 优先权： FR1360538 20131029
- 主分类号： H01H61/02
- IPC分类号： H01H61/02 ; H01H1/58 ; H01H9/02
摘要：
A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.
公开/授权文献
- US10157720B2 Integrated mechanical device with vertical movement 公开/授权日：2018-12-18
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