Invention Application
- Patent Title: Platen Assembly, Chemical-Mechanical Polisher, and Method for Polishing Substrate
- Patent Title (中): 压板装配，化学机械抛光机和抛光基板的方法
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Application No.: US14078999Application Date: 2013-11-13
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Publication No.: US20150133033A1Publication Date: 2015-05-14
- Inventor: Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
- Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing CO., LTD.
- Current Assignee: Taiwan Semiconductor Manufacturing CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: B24B37/34
- IPC: B24B37/34 ; B24B49/12 ; B24B37/10 ; B24B49/10 ; B24B37/20 ; B24B37/005
Abstract:
A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.
Public/Granted literature
- US09352443B2 Platen assembly, chemical-mechanical polisher, and method for polishing substrate Public/Granted day:2016-05-31
Information query
