公开(公告)号：US20240293910A1

公开(公告)日：2024-09-05

申请号：US18663315

申请日：2024-05-14

申请人： Black & Decker Inc.

发明人： Zollie W. PRIVETT, JR. ,  Craig A. OKTAVEC ,  David J. SMITH ,  Matthew J. VELDERMAN ,  Colin C. CROSBY ,  Pradeep PANT ,  Kyle J. CHRISTOPHERSEN ,  Daniel F. NACE ,  James H. STILES, III ,  Floyd E. MORELAND, IV

IPC分类号： B24B23/02 ,  B24B47/10 ,  B24B47/12 ,  B24B49/10 ,  B25F5/00 ,  B25F5/02 ,  H02K5/10 ,  H02K5/16 ,  H02K5/22 ,  H02K7/116 ,  H02K7/14 ,  H02K9/06 ,  H02K11/215 ,  H02K11/33

CPC分类号： B24B23/02 ,  B24B23/028 ,  B24B47/10 ,  B24B47/12 ,  B24B49/10 ,  B25F5/008 ,  B25F5/02 ,  H02K5/10 ,  H02K7/145 ,  H02K11/215 ,  H02K11/33 ,  H02K5/161 ,  H02K5/225 ,  H02K7/116 ,  H02K9/06

摘要： A power tool comprising: a housing including a motor case and a handle portion extending along a longitudinal axis of the housing from the motor case; an electric motor having a drive shaft and mounted within the motor case; a partitioning wall extending radially between the motor case and the handle portion and forming a bearing pocket therein; a rear bearing mounted on the drive shaft and received into the bearing pocket to support the drive shaft relative to the housing; two elongate walls extending rearwardly from the partitioning wall along two sides of the handle portion; a power control module supported by the two elongate walls within the handle portion, the power control module including a circuit board having a motor drive circuit configured to drive the electric motor; and at least one cover secured to the two elongate walls to cover the circuit board.

公开(公告)号：US12076831B2

公开(公告)日：2024-09-03

申请号：US18308878

申请日：2023-04-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yu-Chen Wei ,  Jheng-Si Su ,  Shih-Ho Lin ,  Jen-Chieh Lai ,  Chun-Chieh Chan

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/20 ,  B24B37/32 ,  B24B49/10 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/321

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/04 ,  B24B37/32 ,  B24B49/10 ,  B24B49/16 ,  B24B49/18 ,  B24B53/001 ,  B24B53/017 ,  H01L21/3212

摘要： A chemical mechanical polishing (CMP) apparatus is provided, including a polishing pad and a polishing head. The polishing pad has a polishing surface. The polishing head is configured to hold a wafer in contact with the polishing surface during the polishing process. The polishing head includes a retaining ring, at least one fluid channel, and a vacuum pump. The retaining ring is arranged along the periphery of the polishing head and configured to retain the wafer. The at least one fluid channel is provided inside the polishing head, wherein the retaining ring includes a bottom surface facing the polishing surface and a plurality of holes in fluid communication with the bottom surface and the at least one fluid channel. The vacuum pump is fluidly coupled to the at least one fluid channel.

公开(公告)号：US12057354B2

公开(公告)日：2024-08-06

申请号：US18200244

申请日：2023-05-22

申请人： Applied Materials, Inc.

发明人： Kun Xu ,  Kiran Lall Shrestha ,  Doyle E. Bennett ,  David Maxwell Gage ,  Benjamin Cherian ,  Jun Qian ,  Harry Q. Lee

IPC分类号： H01L21/66 ,  B24B37/013 ,  B24B49/10 ,  G06F17/15 ,  G06N3/08 ,  H01L21/304 ,  H01L21/321

CPC分类号： H01L22/14 ,  B24B37/013 ,  B24B49/105 ,  G06F17/15 ,  G06N3/08 ,  H01L21/304 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26

摘要： A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

公开(公告)号：US12042902B2

公开(公告)日：2024-07-23

申请号：US17455959

申请日：2021-11-22

申请人： CHANGXIN MEMORY TECHNOLOGIES, INC.

发明人： Zhengxian Zhang

IPC分类号： B24B49/10 ,  B24B1/00 ,  G01L1/26 ,  G01L5/00 ,  H01L21/67

CPC分类号： B24B49/10 ,  B24B1/00 ,  G01L1/26 ,  G01L5/0076 ,  H01L21/67092 ,  H01L21/67253

摘要： Force measurement system is provided. It includes: a grinding arm and a stressed layer, the stressed layer being configured to bear a force from the grinding arm; a base and a plurality of elastic bodies, the elastic bodies being fixed between the stressed layer and the base; a deformation sensor, configured to detect deformation of the elastic bodies; and an analysis device, configured to obtain the force on the stressed layer according to a detection result of the deformation sensor and an elastic constant of the elastic body.

公开(公告)号：US20240157501A1

公开(公告)日：2024-05-16

申请号：US18417743

申请日：2024-01-19

申请人： ATM Qness GmbH

发明人： Michael Kley ,  Matthias Höfer

IPC分类号： B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

CPC分类号： B24B31/062 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

摘要： The present disclosure relates to a vibration polishing device, comprising:



a vibration drive for generating an oscillating vibration for polishing samples;
a polishing disc which is connected to and can be driven by the vibration drive; and
a polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc;
wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

公开(公告)号：US11926014B2

公开(公告)日：2024-03-12

申请号：US16330436

申请日：2017-09-05

申请人： ATM Qness GmbH

发明人： Michael Kley ,  Matthias Höfer

IPC分类号： B24B31/00 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

CPC分类号： B24B31/062 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

摘要： The present disclosure relates to a vibration polishing device, comprising:



a vibration drive for generating an oscillating vibration for polishing samples;
polishing disc which is connected to and can be driven by the vibration drive; and
polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc;
wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

公开(公告)号：US20240066663A1

公开(公告)日：2024-02-29

申请号：US18347797

申请日：2023-07-06

申请人： Nanjing Chervon Industry Co., Ltd.

发明人： Zhen Xu

IPC分类号： B24B49/10 ,  B24B7/18 ,  B24B47/12 ,  H02P27/08

CPC分类号： B24B49/10 ,  B24B7/184 ,  B24B47/12 ,  H02P27/085

摘要： A power tool includes an electric motor including multi-phase windings; and a control circuit for controlling the electric motor to rotate. The control circuit includes a driver circuit including multiple switching elements having multiple driving states to drive the electric motor to rotate; a parameter detection module for detecting an electrical parameter of the control circuit; and a controller for outputting a pulse-width modulation (PWM) control signal to control the driver circuit to change the multiple driving states. The controller is configured to change the absolute value of the variation of a duty cycle of the PWM control signal according to the electrical parameter to control a steady-state error of the electric motor running in a constant speed to be within a preset range.

公开(公告)号：US11911872B2

公开(公告)日：2024-02-27

申请号：US17166521

申请日：2021-02-03

申请人： Ebara Corporation

发明人： Nobuyuki Takada ,  Hozumi Yasuda

IPC分类号： B24B9/06 ,  B24B37/30 ,  B24B49/04 ,  B24B49/10 ,  B24B37/04 ,  B24B49/12

CPC分类号： B24B9/065 ,  B24B37/042 ,  B24B37/30 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

公开(公告)号：US11890715B2

公开(公告)日：2024-02-06

申请号：US17355038

申请日：2021-06-22

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Andrew J. Nagengast ,  Justin Ho Kuen Wong

IPC分类号： B24B37/005 ,  B24B37/10 ,  B24B29/00 ,  B24B49/10 ,  B24B47/22 ,  B24B37/32

CPC分类号： B24B37/005 ,  B24B29/00 ,  B24B37/10 ,  B24B49/10 ,  B24B37/32 ,  B24B47/22

摘要： A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.

公开(公告)号：US11865664B2

公开(公告)日：2024-01-09

申请号：US17341285

申请日：2021-06-07

申请人： Applied Materials, Inc.

发明人： Kun Xu ,  Harry Q. Lee ,  Benjamin Cherian ,  David Maxwell Gage

IPC分类号： B24B37/005 ,  H01L21/321 ,  B24B37/013 ,  B24B49/10

CPC分类号： B24B37/005 ,  B24B37/013 ,  B24B49/105 ,  H01L21/3212

摘要： During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter. A first instance receives a sequence of characterizing values from an in-situ monitoring system during an initial time period to control a polishing parameter, and a second instance receives the sequence of characterizing values during the initial time period and a subsequent time period to control the polishing parameter. Exposure of the underlying layer is detected based on the sequence of characterizing values from the in-situ monitoring system.