Invention Application
- Patent Title: Materials and Method for Improving Corner and Edge Coverage of Solid Electrolytic Capacitors
- Patent Title (中): 改善固体电解电容器角点和边缘覆盖的材料和方法
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Application No.: US14490981Application Date: 2014-09-19
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Publication No.: US20150135496A1Publication Date: 2015-05-21
- Inventor: Antony P. Chacko , Yang Jin , Randolph S. Hahn , Yongjian Qiu , Philip M. Lessner , Keith R. Brenneman
- Applicant: Kemet Electronics Corporation
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Main IPC: H01G9/00
- IPC: H01G9/00 ; B05D1/18
Abstract:
A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.
Public/Granted literature
- US09236191B2 Materials and method for improving corner and edge coverage of solid electrolytic capacitors Public/Granted day:2016-01-12
Information query
