Methods and compositions for securing to and removing adhesive tapes from substrates, e.g., delicate substrates such as skin, are described. The methods include providing an adhesive tape comprising an adhesive layer and a support layer in contact with the adhesive layer. A first adhesion level between the adhesive layer and the support layer is, or can be controlled to be, less than a second adhesion level between the adhesive layer and the substrate. The methods further include applying the adhesive tape to the substrate by contacting the adhesive layer to the substrate while the support layer remains in contact with the adhesive layer; and removing the support layer from the substrate by separating the support layer from the adhesive layer.