Invention Application
- Patent Title: HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS
- Patent Title (中): 玻璃陶瓷MCMS中的高速差分接线
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Application No.: US14087341Application Date: 2013-11-22
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Publication No.: US20150144382A1Publication Date: 2015-05-28
- Inventor: Jinwoo Choi , Daniel M. Dreps , Rohan U. Mandrekar
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H05K3/00 ; H05K3/12 ; H05K1/03 ; H05K1/09

Abstract:
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.
Public/Granted literature
- US09232645B2 High speed differential wiring in glass ceramic MCMS Public/Granted day:2016-01-05
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