Invention Application
US20150144382A1 HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS 有权
玻璃陶瓷MCMS中的高速差分接线

HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS
Abstract:
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.
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