Invention Application
- Patent Title: SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
- Patent Title (中): 半导体芯片及其形成方法
-
Application No.: US14491957Application Date: 2014-09-19
-
Publication No.: US20150155216A1Publication Date: 2015-06-04
- Inventor: JONGKOOK KIM , BYOUNG WOOK JANG
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2013-0149210 20131203
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/02 ; H01L21/3105 ; H01L23/00
Abstract:
A semiconductor chip comprising: a substrate; a plurality of pads disposed on the substrate; and a plurality of passivation patterns laterally separated from each other on the substrate, each of the passivation patterns including a plurality of openings, the openings exposing at least one pad of the pads, and the passivation patterns having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate.
Information query
IPC分类:
