Invention Application
- Patent Title: MICROPHONE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 麦克风包装及其制造方法
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Application No.: US14267575Application Date: 2014-05-01
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Publication No.: US20150156575A1Publication Date: 2015-06-04
- Inventor: Tae Hyun KIM , Heung Woo PARK
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2013-0148667 20131202
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H04R31/00
Abstract:
There is provided a microphone package including: a microphone element formed on a semiconductor element; a mold enclosing the semiconductor element and the microphone element; and a conductive pattern formed on one surface of the mold and having a hole formed therein, the hole being connected to the microphone element.
Information query
