A printed circuit board (PCB) a method for processing PCB and an electronic apparatus are provided. The method for processing PCB may include: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has an geoelectric layer thereon; the metal matrix is fixed in a slot provided its the substrate, the formed hole contacts with both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the inner geoelectric layer and the metal matrix are in conduction with each other. The solutions of the embodiments of the application are beneficial to improve reliability of connection between the geoelectric layer and the metal matrix of the PCB, and improve transmission performance of a high frequency signal.