公开(公告)号：US10652992B2

公开(公告)日：2020-05-12

申请号：US16264713

申请日：2019-02-01

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Zhanhao Xie ,  Hua Miao ,  Chuanzhi Li ,  Xudong Chen

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/14 ,  H05K1/11

Abstract: The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

公开(公告)号：US20150163909A1

公开(公告)日：2015-06-11

申请号：US14000566

申请日：2012-06-19

Applicant: SHENNAN CIRCUITS CO LTD.

Inventor： Chuanzhi Li ,  Hua Miao ,  Zhanhao Xie ,  Jun Peng

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/0298 ,  H05K3/0094 ,  H05K3/4635 ,  H05K2201/0792 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10416 ,  Y10T29/49165

Abstract: A printed circuit board (PCB) a method for processing PCB and an electronic apparatus are provided. The method for processing PCB may include: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has an geoelectric layer thereon; the metal matrix is fixed in a slot provided its the substrate, the formed hole contacts with both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the inner geoelectric layer and the metal matrix are in conduction with each other. The solutions of the embodiments of the application are beneficial to improve reliability of connection between the geoelectric layer and the metal matrix of the PCB, and improve transmission performance of a high frequency signal.

Abstract translation: 提供印刷电路板（PCB）用于处理PCB和电子设备的方法。 用于处理PCB的方法可以包括：在PCB中形成孔，其中PCB包括金属基体和至少两个基底层，至少两个基底层中的至少一个在其上具有地电层; 金属基体固定在设置其基板的槽中，形成的孔与地电电极和金属基体接触; 并且在孔中提供导电物质，孔中的导电物质与内部地电电极和金属基体接触，使得内部地电电介质层和金属基体彼此导通。 本申请的实施例的解决方案有利于提高PCB上的地电层和金属矩阵之间的连接的可靠性，并提高高频信号的传输性能。

公开(公告)号：US20230023144A1

公开(公告)日：2023-01-26

申请号：US17956999

申请日：2022-09-30

Applicant: Shennan Circuits Co., Ltd.

Inventor： Beilei Wang ,  Weijing Guo ,  Zhanhao Xie

IPC: H05K1/02 ,  H05K3/10

Abstract: Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.

公开(公告)号：US11450472B2

公开(公告)日：2022-09-20

申请号：US16442562

申请日：2019-06-17

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Beilei Wang ,  Weijing Guo ,  Yuhua Zeng ,  Hua Miao ,  Zhanhao Xie

IPC: H01F27/24 ,  H05K1/11 ,  H05K3/00 ,  H01F27/28 ,  H05K1/02 ,  H01F41/04 ,  H05K1/16 ,  H05K3/06 ,  H05K3/42

Abstract: An electromagnetic device and a method for manufacturing the same are disclosed. The electromagnetic device includes a base plate, a magnetic core, multiple transmission units, and connection layers. The base plate includes a central part defining multiple inner via holes and a peripheral part defining multiple outer via holes. An annular accommodating groove is defined between the central part and the peripheral part. The magnetic core is received in the annular accommodating groove. Transmission units are located on both sides of the base plate. Each transmission unit includes a transmission wire layer including multiple conductive wire patterns, and each conductive wire pattern bridges one inner via hole and one outer via hole. Each of the connection layers is set on one side of the transmission wire layer close to the base plate. At least one connection layer has a dielectric loss no larger than 0.02.

公开(公告)号：US12016115B2

公开(公告)日：2024-06-18

申请号：US17956999

申请日：2022-09-30

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Beilei Wang ,  Weijing Guo ,  Zhanhao Xie

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0263 ,  H05K1/113 ,  H05K3/103 ,  H05K2201/0355 ,  H05K2201/07 ,  H05K2201/08

Abstract: Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.