发明申请
- 专利标题： MEMS Package And A Method For Manufacturing The Same
- 专利标题（中）： MEMS封装及其制造方法
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申请号： US14632428申请日： 2015-02-26
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公开(公告)号： US20150166335A1公开(公告)日： 2015-06-18
- 发明人: Peter V. Loeppert , Denise P. Czech , Lawrence A. Grunert , Kurt B. Friel , Qing Wang
- 申请人： Knowles Electronic LLC
- 专利权人： Knowles Electronic LLC
- 当前专利权人： Knowles Electronic LLC
- 主分类号： B81C1/00
- IPC分类号： B81C1/00
摘要：
A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.
公开/授权文献
- US09399574B2 MEMS package and a method for manufacturing the same 公开/授权日：2016-07-26
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