公开(公告)号：US09399574B2

公开(公告)日：2016-07-26

申请号：US14632428

申请日：2015-02-26

申请人： Knowles Electronic LLC

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L23/00

CPC分类号： B81C1/00888 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L21/56 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

摘要翻译： 通过将多个换能器放置在未分割的封装基板的面板上，将多个单独的盖子附接到面板上并在换能器上方，将环氧树脂沉积到盖子之间的通道中，然后再制造多个MEMS换能器封装 将面板分成单独的MEMS换能器封装。

公开(公告)号：US20150166335A1

公开(公告)日：2015-06-18

申请号：US14632428

申请日：2015-02-26

申请人： Knowles Electronic LLC

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： B81C1/00

CPC分类号： B81C1/00888 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L21/56 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

摘要翻译： 通过将多个换能器放置在未分割的封装基板的面板上，将多个单独的盖子附接到面板上并在换能器上方，将环氧树脂沉积到盖子之间的通道中，然后再制造多个MEMS换能器封装 将面板分成单独的MEMS换能器封装。

公开(公告)号：US20160133271A1

公开(公告)日：2016-05-12

申请号：US14926703

申请日：2015-10-29

申请人： Knowles Electronic, LLC

发明人： Michael Kuntzman

IPC分类号： G10L21/0232 ,  H03F3/183 ,  H04R3/06 ,  H04R19/00 ,  H04R19/04

CPC分类号： H03F3/183 ,  H03F3/187 ,  H03F2200/03 ,  H03F2200/165 ,  H03F2200/372 ,  H04R3/06 ,  H04R19/005 ,  H04R19/04

摘要： An acoustic apparatus includes a microelectromechanical system (MEMS) device, a controlled filter coupled to the MEMS device, and an amplifier. The controllable filter and the amplifier are coupled together at a node. A cut-off frequency of the filter is selectable based upon reception or non-reception of a low frequency audio signal by the acoustic apparatus.

摘要翻译： 声学装置包括微机电系统（MEMS）装置，耦合到MEMS装置的受控滤波器和放大器。 可控滤波器和放大器在一个节点处耦合在一起。 基于声学设备的低频音频信号的接收或不接收，可以选择滤波器的截止频率。