发明申请
- 专利标题: AL ALLOY FILM FOR SEMICONDUCTOR DEVICE
- 专利标题(中): 用于半导体器件的AL合金膜
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申请号: US14117531申请日: 2012-05-16
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公开(公告)号: US20150171016A1公开(公告)日: 2015-06-18
- 发明人: Hiroyuki Okuno , Toshihiro Kugimiya , Yoshihiro Yokota , Takeaki Maeda
- 申请人: Hiroyuki Okuno , Toshihiro Kugimiya , Yoshihiro Yokota , Takeaki Maeda
- 申请人地址: JP Kobe-shi
- 专利权人: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人地址: JP Kobe-shi
- 优先权: JP2011-110791 20110517
- 国际申请: PCT/JP12/62561 WO 20120516
- 主分类号: H01L23/532
- IPC分类号: H01L23/532 ; C22C21/02 ; H01L29/20 ; C22C21/12 ; C22C21/14 ; H01L29/16 ; H01J37/34 ; C22C21/00
摘要:
Provided is an Al alloy film for semiconductor devices, which has excellent heat resistance and is suppressed in the generation of hillocks even in cases where the Al alloy film is exposed to high temperatures, and which has low electrical resistivity as a film. The present invention relates to an Al alloy film for semiconductor devices, which is characterized by satisfying all of the features (a)-(c) described below after being subjected to a heat treatment wherein the Al alloy film is held at 500° C. for 30 minutes and by having a film thickness from 500 nm to 5 μm. (a) The maximum grain diameter of the Al matrix is 800 nm or less. (b) The hillock density is less than 1×109 pieces/m2. (c) The electrical resistivity is 10 μΩcm or less.
公开/授权文献
- US09153536B2 Al alloy film for semiconductor device 公开/授权日:2015-10-06