发明申请
- 专利标题: SUPPORTING BASE FOR SEMICONDUCTOR CHIP
- 专利标题(中): 支持半导体芯片的基础
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申请号: US14140509申请日: 2013-12-25
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公开(公告)号: US20150176800A1公开(公告)日: 2015-06-25
- 发明人: CHIEN-YU CHEN , CHING-AN WU
- 申请人: I-CHIUN PRECISION INDUSTRY CO., LTD.
- 申请人地址: TW New Taipei City
- 专利权人: I-CHIUN PRECISION INDUSTRY CO., LTD.
- 当前专利权人: I-CHIUN PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW New Taipei City
- 主分类号: F21V7/00
- IPC分类号: F21V7/00
摘要:
A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.
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