发明申请
- 专利标题: METHOD FOR CUTTING HIGH-HARDNESS MATERIAL BY MULTI-WIRE SAW
- 专利标题(中): 通过多线切割高硬度材料的方法
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申请号: US14423471申请日: 2013-08-30
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公开(公告)号: US20150183132A1公开(公告)日: 2015-07-02
- 发明人: Sadahiko Kondo , Akira Miyachi , Toshihiko Hatanaka
- 申请人: HITACHI METALS, LTD.
- 优先权: JP2012-193150 20120903
- 国际申请: PCT/JP2013/073292 WO 20130830
- 主分类号: B28D5/04
- IPC分类号: B28D5/04
摘要:
This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.
公开/授权文献
- US09597819B2 Method for cutting high-hardness material by multi-wire saw 公开/授权日:2017-03-21