Invention Application
- Patent Title: CURABLE COMPOSITIONS AND THERMOSETS PREPARED THEREFROM
- Patent Title (中): 可固化的组合物和其制备的热稳定剂
-
Application No.: US14423864Application Date: 2013-10-25
-
Publication No.: US20150183923A1Publication Date: 2015-07-02
- Inventor: Stephanie L. Potisek , Michael J. Mullins
- Applicant: Dow Global Technologies LLC
- International Application: PCT/US2013/066738 WO 20131025
- Main IPC: C08G59/02
- IPC: C08G59/02 ; C09J163/00 ; C09D163/00

Abstract:
A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein R1 and R2 are hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that R1 and R2 are not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition.
Public/Granted literature
- US09382373B2 Curable compositions and thermosets prepared therefrom Public/Granted day:2016-07-05
Information query