发明申请
US20150184032A1 TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
审中-公开
用于制造半导体器件的临时粘合剂，以及使用该半导体器件的半导体器件的粘合支持和生产方法
- 专利标题： TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
- 专利标题（中）： 用于制造半导体器件的临时粘合剂，以及使用该半导体器件的半导体器件的粘合支持和生产方法
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申请号： US14641656申请日： 2015-03-09
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公开(公告)号： US20150184032A1公开(公告)日： 2015-07-02
- 发明人: Yu IWAI , Ichiro KOYAMA
- 申请人： FUJIFILM Corporation
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2012-218585 20120928; JP2013-097784 20130507
- 主分类号： C09J4/00
- IPC分类号： C09J4/00 ; H01L21/306 ; C09J101/14 ; C09J125/06 ; C09J101/12 ; H01L21/304 ; H01L21/683
摘要：
By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.
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