Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14613179Application Date: 2015-02-03
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Publication No.: US20150187606A1Publication Date: 2015-07-02
- Inventor: Yukihiro SATO , Nobuya KOIKE
- Applicant: RENESAS ELECTRONICS CORPORATION
- Priority: JP2012-066997 20120323
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495
Abstract:
There is provided a technology enabling the improvement of the reliability of a semiconductor device manufactured by physically fixing separately formed chip mounting portion and lead frame. A feature of an embodiment resides in that, a second junction portion formed in a suspension lead is fitted into a first junction portion formed in a chip mounting portion, thereby to physically fix the chip mounting portion and the suspension lead. Specifically, the first junction portion is formed of a concave part disposed in the surface of the chip mounting portion. The second junction portion forms a part of the suspension lead.
Public/Granted literature
- US09230831B2 Semiconductor device and a manufacturing method thereof Public/Granted day:2016-01-05
Information query
IPC分类:
