发明申请
- 专利标题: Thermoplastic, Semiconductive Compositions
- 专利标题(中): 热塑性,半导体组合物
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申请号: US14374112申请日: 2013-01-29
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公开(公告)号: US20150200038A1公开(公告)日: 2015-07-16
- 发明人: Mohamed Esseghir , Jeffrey M. Cogen , Saurav S. Sengupta , Neil W. Dunchus
- 申请人: Dow Global Technologies LLC
- 国际申请: PCT/US2013/023588 WO 20130129
- 主分类号: H01B1/24
- IPC分类号: H01B1/24
摘要:
Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt % silane-functionalized polyethylene; B. 0.5-20 wt % organopolysiloxane containing two or more functional end groups; C. 10-20 wt % high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05-0.2 wt % crosslinking catalyst.
公开/授权文献
- US09595365B2 Thermoplastic, semiconductive compositions 公开/授权日:2017-03-14
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