Thermoplastic, Semiconductive Compositions
    3.
    发明申请
    Thermoplastic, Semiconductive Compositions 有权
    热塑性,半导体组合物

    公开(公告)号:US20150200038A1

    公开(公告)日:2015-07-16

    申请号:US14374112

    申请日:2013-01-29

    IPC分类号: H01B1/24

    CPC分类号: H01B1/24 C08L101/10

    摘要: Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt % silane-functionalized polyethylene; B. 0.5-20 wt % organopolysiloxane containing two or more functional end groups; C. 10-20 wt % high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05-0.2 wt % crosslinking catalyst.

    摘要翻译: 基于组合物的重量,具有小于1000欧姆 - 厘米的稳定体积电阻率的可交联的,半导电的,无过氧化物的热塑性组合物包括:A.60-90重量%的硅烷官能化聚乙烯; B.含有两个或更多个官能端基的0.5-20wt%有机聚硅氧烷; C.10-20重量%的高导电率炭黑,例如平均粒度为50nm以下的炭黑,700-1250m 2 / g的表面积(BET)和70-1250m 2 / g的吸油量(DBP) 300-500ml / 100g; 和D. 0.05-0.2重量%的交联催化剂。