Invention Application
- Patent Title: STACKED CONDUCTIVE INTERCONNECT INDUCTOR
- Patent Title (中): 堆叠导电互连电感器
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Application No.: US14155187Application Date: 2014-01-14
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Publication No.: US20150201495A1Publication Date: 2015-07-16
- Inventor: Daeik Daniel KIM , Mario Francisco VELEZ , Chengjie ZUO , Changhan Hobie YUN , Jonghae KIM , Matthew Michael NOWAK
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K3/06 ; H05K1/18
Abstract:
An integrated circuit device includes a first substrate supporting a pair of conductive interconnects, for example pillars. The device also includes a second substrate on the pair of conductive interconnects. The pair of conductive interconnects is arranged to operate as a first 3D solenoid inductor. The device further includes a conductive trace coupling the pair of conductive interconnects to each other.
Information query
