There is provided a method for manufacturing an electronic component package. The method comprises the steps: (i) forming a package precursor in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer; (ii) disposing a metal foil having a through-hole on the surface of the sealing resin layer such that the through-hole of the metal foil is positioned in an opposed relation to the electrode of the electronic component; and (iii) forming a metal plating layer on the metal foil, wherein the formation of the metal plating layer in the step (iii) is performed by a dry plating process and a subsequent wet plating process, whereby the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other.