-
公开(公告)号：US20150221842A1
公开(公告)日：2015-08-06
申请号：US14422972
申请日：2013-12-20
Inventor： Kazuma Mima , Seiichi Nakatani , Yoshihisa Yamashita , Koji Kawakita , Susumu Sawada
CPC classification number: H01L33/62 , H01L21/4846 , H01L21/56 , H01L21/76873 , H01L21/76874 , H01L21/76877 , H01L21/76879 , H01L23/481 , H01L33/52 , H01L33/64 , H01L2224/0346 , H01L2224/03462 , H01L2224/03825 , H01L2224/2746 , H01L2224/27462 , H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014
Abstract: There is provided a method for manufacturing an electronic component package. The method includes (i) providing a package precursor in which an electronic component is embedded such that an electrode of the electronic component is exposed at a surface of a sealing resin layer; (ii) forming a first metal plating layer such that the first metal plating layer is in contact with the exposed surface of the electrode of the electronic component; (iii) disposing a metal foil in face-to-face spaced relationship with respect to the first metal plating layer; and (iv) forming a second metal plating layer, wherein in the step (iv), the second metal plating layer is formed to fill a clearance between the first metal plating layer and the metal foil with the second metal plating layer, and thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with each other.
Abstract translation: 提供一种电子部件封装的制造方法。 该方法包括（i）提供其中嵌入电子部件的封装前体，使得电子部件的电极在密封树脂层的表面露出; （ii）形成第一金属镀层，使得第一金属镀层与电子部件的电极的暴露表面接触; （iii）相对于所述第一金属镀层以面对面间隔的关系设置金属箔; 和（iv）形成第二金属镀层，其中在步骤（iv）中，形成第二金属镀层以在第一金属镀层和金属箔之间用第二金属镀层填充间隙， 金属箔，第一金属镀层和第二金属镀层。
-
公开(公告)号：US20150155251A1
公开(公告)日：2015-06-04
申请号：US14402221
申请日：2013-08-02
Inventor： Koji Kawakita , Susumu Sawada , Seiichi Nakatani , Yoshihisa Yamashita
CPC classification number: H01L24/32 , H01L23/3677 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/83 , H01L24/94 , H01L24/96 , H01L33/60 , H01L33/647 , H01L2224/0346 , H01L2224/04042 , H01L2224/04105 , H01L2224/05567 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/14 , H01L2224/2746 , H01L2224/2784 , H01L2224/32113 , H01L2224/3224 , H01L2224/3226 , H01L2224/45144 , H01L2224/48091 , H01L2224/48639 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/49107 , H01L2224/73267 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/2064 , H01L2924/2075 , H01L2924/351 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00 , H01L2224/82 , H01L2224/03 , H01L2924/00015 , H01L2224/05552 , H01L2924/00012
Abstract: There is provided a semiconductor device. The semiconductor device of the present invention includes a semiconductor element and a metal buffer layer in an electrical connection to the semiconductor element. The metal buffer layer and the semiconductor element are in a connection with each other by mutual surface contact of the metal buffer layer and the semiconductor element. The metal buffer layer is an external connection terminal used for a mounting with respect to a secondary mount substrate, and the metal buffer layer serves as a buffer part having a stress-relaxation effect between the semiconductor element and the secondary mount substrate.
Abstract translation: 提供了一种半导体器件。 本发明的半导体器件包括与半导体元件电连接的半导体元件和金属缓冲层。 金属缓冲层和半导体元件通过金属缓冲层和半导体元件的相互表面接触而彼此连接。 金属缓冲层是用于相对于辅助安装基板的安装的外部连接端子，并且金属缓冲层用作在半导体元件和辅助安装基板之间具有应力松弛效应的缓冲部分。
-
公开(公告)号：US09825209B2
公开(公告)日：2017-11-21
申请号：US14422972
申请日：2013-12-20
Inventor： Kazuma Mima , Seiichi Nakatani , Yoshihisa Yamashita , Koji Kawakita , Susumu Sawada
IPC: H01L23/48 , H01L21/00 , H01L33/00 , H01L23/02 , H01L23/52 , H01L29/40 , C25D7/12 , C25D11/32 , H01L33/62 , H01L33/64 , H01L21/48 , H01L33/52 , H01L21/768 , H01L21/56
CPC classification number: H01L33/62 , H01L21/4846 , H01L21/56 , H01L21/76873 , H01L21/76874 , H01L21/76877 , H01L21/76879 , H01L23/481 , H01L33/52 , H01L33/64 , H01L2224/0346 , H01L2224/03462 , H01L2224/03825 , H01L2224/2746 , H01L2224/27462 , H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014
Abstract: A method for manufacturing an electronic component package. The method includes (i) providing a package precursor in which an electronic component is embedded such that an electrode of the electronic component is exposed at a surface of a sealing resin layer; (ii) forming a first metal plating layer such that the first metal plating layer is in contact with the exposed surface of the electrode of the electronic component; (iii) disposing a metal foil in face-to-face spaced relationship with respect to the first metal plating layer; and (iv) forming a second metal plating layer. In step (iv), the second metal plating layer is formed so as to fill a clearance between the first metal plating layer and the metal foil, thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with each other.
-
公开(公告)号：US09541518B2
公开(公告)日：2017-01-10
申请号：US14131522
申请日：2012-12-12
Inventor： Yoshihisa Yamashita , Seiichi Nakatani , Tetsuyoshi Ogura , Koichi Hirano , Makoto Takahashi , Satoshi Arimoto
IPC: G01N27/327 , G01N27/30 , H01R43/16
CPC classification number: G01N27/30 , G01N27/3277 , H01R43/16 , Y10T29/49204
Abstract: An electrochemical detector is an electrochemical detector for detecting a substance in a liquid by generating a redox cycle, the electrochemical detector comprising: a first working electrode having a first electrode surface, a second working electrode having a second electrode surface, and a plurality of insulating spacer particles, wherein the first and second electrode surfaces are placed so as to face each other so that an electric field is formed between the first and second electrode surfaces, and the plurality of spacer particles are placed along the first and second electrode surfaces so as to separate the first and second electrode surfaces from each other.
Abstract translation: 电化学检测器是一种用于通过产生氧化还原循环来检测液体中的物质的电化学检测器，该电化学检测器包括：具有第一电极表面的第一工作电极，具有第二电极表面的第二工作电极和多个绝缘 间隔物颗粒，其中第一和第二电极表面被放置成彼此面对，使得在第一和第二电极表面之间形成电场，并且多个间隔物颗粒沿着第一和第二电极表面放置，以便 以将第一和第二电极表面彼此分离。
-
公开(公告)号：US20150236233A1
公开(公告)日：2015-08-20
申请号：US14422990
申请日：2013-12-20
Inventor： Yoshihisa Yamashita , Seiichi Nakatani , Koji Kawakita , Susumu Sawada
CPC classification number: H01L33/647 , C23C14/34 , C23C14/5846 , H01L21/76873 , H01L21/76879 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L24/19 , H01L24/97 , H01L25/167 , H01L33/52 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/0346 , H01L2224/03825 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/8203 , H01L2224/92144 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19105 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2224/82 , H01L2924/00 , H01L2924/00012
Abstract: A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of the principal surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on the principal surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on the principal surface “B”. A dry plating process and a subsequent wet plating process are performed to form the metal plating layer in the (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other.
Abstract translation: 一种电子部件封装的制造方法，其特征在于，具备：（i）制作具有相对的主面“A”用于配置电子部件和主面“B”的金属箔，以及位于电子部件配置区域 主面“A”; （ii）将电子部件放置在金属箔上使得电子部件位于电子部件放置区域中，并且通孔的开口用电子部件的电极封盖; （iii）在主表面“A”上形成密封树脂层，使得电子部件被密封树脂层覆盖; 和（iv）在主表面“B”上形成金属镀层。 进行干电镀处理和随后的湿式电镀处理，以在（iv）中形成金属镀层，使得通孔填充有金属镀层，金属箔和金属镀层与每个 其他。
-
Patent Agency Ranking
公开(公告)号：US20150214129A1
公开(公告)日：2015-07-30
申请号：US14422505
申请日：2013-12-20
Inventor： Koji Kawakita , Seiichi Nakatani , Susumu Sawada , Yoshihisa Yamashita
CPC classification number: H01L23/367 , H01L21/4846 , H01L21/4871 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3135 , H01L23/36 , H01L23/49575 , H01L23/5389 , H01L24/97 , H01L25/0753 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2224/16 , H01L2224/16225 , H01L2224/16245 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19105 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: There is provided a method for manufacturing an electronic component package, wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer. In the manufacturing method of the present invention, a combination of a formation process of a plurality of metal plating layers and a patterning process of the metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, the patterning process being performed by a patterning of at least two of the metal plating layers.
Abstract translation: 提供一种电子部件封装的制造方法，其中提供封装前体，其中将电子部件嵌入密封树脂层中，使得电子部件的电极在密封树脂层的表面露出。 在本发明的制造方法中，提供多个金属镀层的形成工艺和金属镀层的图案化工艺的组合以形成阶梯状金属镀层，形成工序通过顺序 相对于封装前体进行干法和湿式电镀处理，所述图案化工艺通过图案化至少两个所述金属镀层进行。
-
公开(公告)号：US09449944B2
公开(公告)日：2016-09-20
申请号：US14422615
申请日：2013-12-20
Inventor： Susumu Sawada , Seiichi Nakatani , Yoshihisa Yamashita , Koji Kawakita
IPC: H01L31/0203 , H01L25/065 , H01L33/54 , H01L33/62 , H01L23/31 , H01L21/56 , H01L23/00 , H01L21/288 , H01L23/538 , H01L25/16 , H01L25/00 , H01L33/50 , H01L21/48 , H01L25/075 , H01L23/433 , H01L23/367
CPC classification number: H01L25/0655 , H01L21/288 , H01L21/4878 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3121 , H01L23/3135 , H01L23/367 , H01L23/433 , H01L23/5386 , H01L24/83 , H01L24/96 , H01L25/0753 , H01L25/167 , H01L25/50 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8385 , H01L2224/96 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2224/32225 , H01L2924/00014 , H01L2224/32245 , H01L2924/00 , H01L2224/03 , H01L2224/11
Abstract: There is provided a method for manufacturing an electronic component package, wherein a first electronic component and a second electronic component are placed on a carrier, and a sealing resin layer is formed on the carrier, followed by the carrier being peeled away to be removed, and thereby providing a package precursor in which the first and second electronic components are embedded such that an electrode of at least one of the first and second electronic components is exposed at a surface of the sealing resin layer. Upon the placing of the first and second electronic components, the first and second electronic components are positioned such that their height levels differ from each other. After the removal of the carrier, a metal plating layer is formed such that the metal plating layer is in contact with the exposed surface of the electrode of the at least one of the first and second electronic components.
Abstract translation: 提供了一种制造电子部件封装的方法，其中第一电子部件和第二电子部件被放置在载体上，并且在载体上形成密封树脂层，随后将载体剥离以除去， 从而提供封装前体，其中嵌入第一和第二电子部件，使得第一和第二电子部件中的至少一个的电极在密封树脂层的表面露出。 在放置第一和第二电子部件时，第一和第二电子部件被定位成使得它们的高度水平彼此不同。 在移除载体之后，形成金属镀层，使得金属镀层与第一和第二电子部件中的至少一个的电极的暴露表面接触。
-
公开(公告)号：US09449937B2
公开(公告)日：2016-09-20
申请号：US14402221
申请日：2013-08-02
Inventor： Koji Kawakita , Susumu Sawada , Seiichi Nakatani , Yoshihisa Yamashita
IPC: H01L23/00 , H01L33/64 , H01L23/367 , H01L33/60
CPC classification number: H01L24/32 , H01L23/3677 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/83 , H01L24/94 , H01L24/96 , H01L33/60 , H01L33/647 , H01L2224/0346 , H01L2224/04042 , H01L2224/04105 , H01L2224/05567 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/14 , H01L2224/2746 , H01L2224/2784 , H01L2224/32113 , H01L2224/3224 , H01L2224/3226 , H01L2224/45144 , H01L2224/48091 , H01L2224/48639 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/49107 , H01L2224/73267 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/2064 , H01L2924/2075 , H01L2924/351 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00 , H01L2224/82 , H01L2224/03 , H01L2924/00015 , H01L2224/05552 , H01L2924/00012
Abstract: There is provided a semiconductor device. The semiconductor device of the present invention includes a semiconductor element and a metal buffer layer in an electrical connection to the semiconductor element. The metal buffer layer and the semiconductor element are in a connection with each other by mutual surface contact of the metal buffer layer and the semiconductor element. The metal buffer layer is an external connection terminal used for a mounting with respect to a secondary mount substrate, and the metal buffer layer serves as a buffer part having a stress-relaxation effect between the semiconductor element and the secondary mount substrate.
Abstract translation: 提供了一种半导体器件。 本发明的半导体器件包括与半导体元件电连接的半导体元件和金属缓冲层。 金属缓冲层和半导体元件通过金属缓冲层和半导体元件的相互表面接触而彼此连接。 金属缓冲层是用于相对于辅助安装基板的安装的外部连接端子，并且金属缓冲层用作在半导体元件和辅助安装基板之间具有应力松弛效应的缓冲部分。
-
9.发明申请LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVING LIGHT EMITTING DEVICE MOUNTED THEREON 审中-公开发光装置，其制造方法和具有安装在其上的发光装置的身体公开(公告)号：US20150280093A1
公开(公告)日：2015-10-01
申请号：US14437037
申请日：2013-08-02
Inventor： Yoshihiro Tomita , Susumu Sawada , Seiichi Nakatani , Koji Kawakita , Yoshihisa Yamashita
CPC classification number: H01L33/644 , H01L23/36 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/33 , H01L33/385 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/02379 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05548 , H01L2224/05552 , H01L2224/05557 , H01L2224/0612 , H01L2224/14 , H01L2224/26175 , H01L2224/291 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/96 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/351 , H01L2933/0016 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2224/03 , H01L2924/014 , H01L2924/00 , H01L2924/00012
Abstract: There is provided a light-emitting device comprising a light-emitting element, an element electrode, an extending-wiring electrode and a support. In the light-emitting device of the present invention, the light-emitting element is supported and secured by the support in such a form that a principal surface of the support and an active surface of the light-emitting element are approximately flush with each other. Further, the extending-wiring electrode is in a surface contact with the element electrode such that the extending-wiring electrode extends beyond a periphery of the light-emitting element to the principal surface of the support, wholly covering the active surface of the light-emitting element.
Abstract translation: 提供了一种包括发光元件，元件电极，延伸布线电极和支撑体的发光器件。 在本发明的发光装置中，发光元件以支撑体的主面和发光元件的有效面相互大致齐平的形式被支撑体支撑固定 。 此外，延伸布线电极与元件电极表面接触，使得延伸布线电极延伸超过发光元件的周边到支撑体的主表面，完全覆盖发光元件的有源表面， 发光元件。
-
公开(公告)号：US20150076545A1
公开(公告)日：2015-03-19
申请号：US14397289
申请日：2013-08-02
Inventor： Seiichi Nakatani , Yoshihisa Yamashita , Koji Kawakita , Susumu Sawada
CPC classification number: H01L24/27 , H01L21/4821 , H01L21/561 , H01L21/568 , H01L23/02 , H01L23/49541 , H01L24/19 , H01L24/73 , H01L24/83 , H01L24/96 , H01L33/486 , H01L33/50 , H01L2224/04105 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/838 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/15192 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/00014 , H01L2924/00 , H01L2224/19 , H01L2224/48227 , H01L2924/00012
Abstract: There is provided a method for manufacturing an electronic component package. The method includes the steps: (i) disposing a metal pattern layer on an adhesive carrier; (ii) placing at least one kind of electronic component on the adhesive carrier, the placed electronic component being not overlapped with respect to the metal pattern layer; (iii) forming a sealing resin layer on the adhesive carrier, and thereby producing a precursor of the electronic component package; (iv) peeling off the adhesive carrier of the precursor, whereby the metal pattern layer and an electrode of the electronic component are exposed at the surface of the sealing resin layer; and (v) forming a metal plating layer such that the metal plating layer is in contact with the exposed surface of the metal pattern layer and the exposed surface of the electrode of the electronic component.
Abstract translation: 提供一种电子部件封装的制造方法。 该方法包括以下步骤：（i）在粘合剂载体上设置金属图案层; （ii）将至少一种电子部件放置在粘合剂载体上，所放置的电子部件不相对于金属图案层重叠; （iii）在粘合剂载体上形成密封树脂层，从而制备电子部件封装的前体; （iv）剥离前体的粘合剂载体，由此金属图案层和电子部件的电极在密封树脂层的表面露出; 和（v）形成金属镀层，使得金属镀层与金属图案层的暴露表面和电子部件的电极的暴露表面接触。
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.02 seconds)
