Invention Application
US20150214095A1 Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process 有权
使用印刷方法在半导体本体上生产铜层的方法

Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process
Abstract:
A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating, printing a metal particle paste on the semiconductor wafer thereby forming a metal layer and heating the metal layer in a reductive gas for sintering the metal particle paste or for annealing a sintered metal particle paste in an oven.
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