Invention Application
US20150228511A1 METHODS AND SYSTEMS FOR VIBRATORY CHEMICAL MECHANICAL PLANARIZATION
审中-公开
振动化学机械平面化方法与系统
- Patent Title: METHODS AND SYSTEMS FOR VIBRATORY CHEMICAL MECHANICAL PLANARIZATION
- Patent Title (中): 振动化学机械平面化方法与系统
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Application No.: US14176545Application Date: 2014-02-10
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Publication No.: US20150228511A1Publication Date: 2015-08-13
- Inventor: Michael Wedlake
- Applicant: Globalfoundries, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: Globalfoundries, Inc.
- Current Assignee: Globalfoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306
Abstract:
Methods and a system for processing semiconductor substrates are provided. A method of processing a semiconductor substrate includes selecting a predetermined vibration profile that will achieve predetermined material removal characteristics from the semiconductor substrate in a chemical mechanical planarization (CMP) polish, actuating a vibration actuator based on the predetermined vibration profile, and polishing the semiconductor substrate based substantially entirely on the predetermined vibration profile achieved by actuation of the vibration actuator.
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