发明申请
- 专利标题： WAFER HANDLER AND METHODS OF MANUFACTURE
- 专利标题（中）： WAFER处理器和制造方法
-
申请号： US14183989申请日： 2014-02-19
-
公开(公告)号： US20150235891A1公开(公告)日： 2015-08-20
- 发明人: John J. Garant , Jonathan H. Griffith , Brittany L. Hedrick , Edmund J. Sprogis
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; B32B38/10 ; B32B37/24 ; H01L21/02 ; B32B37/26
摘要：
A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.
公开/授权文献
- US09613842B2 Wafer handler and methods of manufacture 公开/授权日：2017-04-04
信息查询
IPC分类:
