An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with an interconnect stack that has layers of dielectric and metal traces forming signal paths. Electrical components may be mounted on printed circuits. Coupling structures such as screws or other fasteners, washers, standoffs, nuts, springs, and spring-loaded pins may be used in forming signal paths that couple the signal paths of the interconnect stack to components such as buttons, batteries, printed circuits with integrated circuits, displays, and other circuitry.