Invention Application
- Patent Title: High Aspect Ratio Structure Analysis
- Patent Title (中): 高宽比结构分析
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Application No.: US14433354Application Date: 2013-10-04
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Publication No.: US20150243478A1Publication Date: 2015-08-27
- Inventor: Sang Hoon Lee , Stacey Stone , Jeffrey Blackwood , Michael Schmidt
- Applicant: FEI COMPANY
- Applicant Address: US OR Hillsboro
- Assignee: FEI Company
- Current Assignee: FEI Company
- Current Assignee Address: US OR Hillsboro
- International Application: PCT/US2013/063479 WO 20131004
- Main IPC: H01J37/305
- IPC: H01J37/305 ; C23C14/46

Abstract:
Curtaining artifacts on high aspect ratio features are reduced by reducing the distance between a protective layer and feature of interest. For example, the ion beam can mill at an angle to the work piece surface to create a sloped surface. A protective layer is deposited onto the sloped surface, and the ion beam mills through the protective layer to expose the feature of interest for analysis. The sloped mill positions the protective layer close to the feature of interest to reduce curtaining.
Public/Granted literature
- US09741536B2 High aspect ratio structure analysis Public/Granted day:2017-08-22
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