Invention Application
- Patent Title: DEVICES WITH THINNED WAFER
- Patent Title (中): 带有薄膜的设备
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Application No.: US14194912Application Date: 2014-03-03
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Publication No.: US20150246809A1Publication Date: 2015-09-03
- Inventor: Andre Brockmeier , Christian Griessler , Katharina Maier , Peter Zorn , Kai-Alexander Schreiber , Francesco Solazzi
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81C99/00 ; B32B38/08 ; B81B7/00 ; B32B37/00 ; B32B38/10
Abstract:
Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 μm or below.
Public/Granted literature
- US09428381B2 Devices with thinned wafer Public/Granted day:2016-08-30
Information query
