Invention Application
- Patent Title: CONDUCTIVE COMPOSITION AND CONDUCTIVE MOLDED BODY
- Patent Title (中): 导电组合物和导电成型体
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Application No.: US14430406Application Date: 2013-01-11
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Publication No.: US20150247067A1Publication Date: 2015-09-03
- Inventor: Taisuke Iseda , Masahiro Iwamoto
- Applicant: MITSUBOSHI BELTING LTD.
- Applicant Address: JP Kobe-shi, Hyogo
- Assignee: MITSUBOSHI BELTING LTD.
- Current Assignee: MITSUBOSHI BELTING LTD.
- Current Assignee Address: JP Kobe-shi, Hyogo
- Priority: JP2012-215007 20120927; JP2012-252057 20121116
- International Application: PCT/JP2013/050490 WO 20130111
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C08K3/08 ; C09J163/00
Abstract:
The present invention relates to a conductive composition containing a conductive metal powder and an epoxy resin component in which the conductive metal powder contains a metal flake and the epoxy resin component contains a polyfunctional epoxy resin having three or more epoxy groups.
Public/Granted literature
- US09773582B2 Conductive composition and conductive molded body Public/Granted day:2017-09-26
Information query
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