发明申请
- 专利标题： Package Structure To Enhance Yield of TMI Interconnections
- 专利标题（中）： 包装结构以提高TMI互连的产量
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申请号： US14198479申请日： 2014-03-05
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公开(公告)号： US20150255415A1公开(公告)日： 2015-09-10
- 发明人: Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
- 申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L21/768
摘要：
An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
公开/授权文献
- US09613933B2 Package structure to enhance yield of TMI interconnections 公开/授权日：2017-04-04
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