Invention Application
- Patent Title: Pressure Equalization in Earphones
- Patent Title (中): 耳机压力均衡
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Application No.: US14211556Application Date: 2014-03-14
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Publication No.: US20150264467A1Publication Date: 2015-09-17
- Inventor: Kevin P. Annunziato , Jason Harlow , Mihir D. Shetye , Ryan C. Silvestri
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
A headphone includes an electro-acoustic transducer dividing an enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ear, and an ear tip configured to surround the first port and including a flap to seal the ear canal from space outside the ear. The second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component, reducing the occlusion effect that otherwise results from sealing the ear.
Public/Granted literature
- US09301040B2 Pressure equalization in earphones Public/Granted day:2016-03-29
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