发明申请
US20150279569A1 MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
审中-公开
多层陶瓷电容器,具有多层陶瓷电容器的电路板的安装结构,多层陶瓷电容器的包装单元
- 专利标题: MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
- 专利标题(中): 多层陶瓷电容器,具有多层陶瓷电容器的电路板的安装结构,多层陶瓷电容器的包装单元
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申请号: US14731229申请日: 2015-06-04
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公开(公告)号: US20150279569A1公开(公告)日: 2015-10-01
- 发明人: Young Ghyu AHN , Sang Soo PARK , Min Cheol PARK , Byoung Hwa LEE
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2012-0126449 20121109
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/12 ; H01G4/38 ; H01G2/06 ; H05K1/11 ; H01G4/012 ; H01G4/248
摘要:
There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.
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