A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%