BONDING METHOD
    1.
    发明申请
    BONDING METHOD 有权
    结合方法

    公开(公告)号:US20150283642A1

    公开(公告)日:2015-10-08

    申请号:US14645956

    申请日:2015-03-12

    Abstract: A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%

    Abstract translation: 将第一制品粘合到第二制品的方法,每个制品具有相应的粘合表面。 该方法包括在第一和第二制品的接合表面之间插入多孔中间层区域,随后使用电阻加热在接触压力下将层间区域局部加热到低于中间层的熔融温度的接合温度,并且第一和第二制品 从而将中间层粘合到第一和第二制品上以形成粘合制品。 中间层具有约10%至30%之间的孔隙率,

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