Invention Application
- Patent Title: IP PROTECTION
- Patent Title (中): IP保护
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Application No.: US14751170Application Date: 2015-06-26
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Publication No.: US20150294964A1Publication Date: 2015-10-15
- Inventor: Soon Yoeng TAN , Teck Jung TANG , Ian D. MELVILLE , Yelei Vianna YAO , Yasushi YAMAGATA
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd. , International Business Machines Corporation , Renesas Electronics Corporation
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/66
Abstract:
Multi-Project Wafers includes a plurality of chiplets from different IP owners. Non-relevant chiplets are implemented with IP protection to inhibit IP disclosure of non-relevant IP owners.
Public/Granted literature
- US09947645B2 Multi-project wafer with IP protection by reticle mask pattern modification Public/Granted day:2018-04-17
Information query
IPC分类:
