- 专利标题: Bowl-shaped solder structure
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申请号: US14754293申请日: 2015-06-29
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公开(公告)号: US20150303157A1公开(公告)日: 2015-10-22
- 发明人: Cyprian Emeka Uzoh , Rajesh Katkar
- 申请人: Invensas Corporation
- 申请人地址: US CA San Jose
- 专利权人: INVENSAS CORPORATION
- 当前专利权人: INVENSAS CORPORATION
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L21/3213
摘要:
An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.
公开/授权文献
- US09455237B2 Bowl-shaped solder structure 公开/授权日:2016-09-27