It is described a testing head for a testing equipment of an electronic device comprising at least one upper guide and a lower guide provided with guide holes, a plurality of contact probes inserted into the guide holes of the upper and lower guides and at least one containment element of the probes being is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested; at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, the spacer element being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide.