发明申请
US20150314417A1 POLISHING PAD CONDITIONING SYSTEM INCLUDING SUCTION 有权
抛光垫调节系统,包括吸收

POLISHING PAD CONDITIONING SYSTEM INCLUDING SUCTION
摘要:
A system for use in substrate polishing includes a conditioner system for conditioning a surface of a polishing pad and a vacuum system having a vacuum port. The conditioner system includes a conditioner head constructed to receive an abrasive conditioner component. The vacuum system is configured to apply suction through the vacuum port to the surface of the polishing pad in a direction away from the surface to remove material on the surface.
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